Letter for BMGXIII

Dear speakers and colleagues:

On behalf of the organizing committee of BMG XIII, we regrettably inform you that the BMG XIII conference has to be postponed to sometime in Spring 2020 because of the recent social movements in Hong Kong. The committee has decided to move the location of the conference from Hong Kong to Shenzhen after several meetings and extensive discussions. This is a rather sad and painful decision; however, we must assure that this conference can be held in a safe and pleasant environment. We apologize for any inconvenience that might have caused by these changes. The detailed information on the exact conference date and venue will be announced later.

Over the past few months, we have strived to complete almost all preparation works for the conference, including the technical program, reservation of local restaurants, purchase of souvenirs, meeting room assignment, fund raising, etc. However, during this period of time, we also received many queries from our speakers and colleagues, through emails or private communications, about whether Hong Kong is still safe to visit in December 2019. In September, the social order seemed to be restored a little, but suddenly became unsettled in October. There appears no sign for the society to reach consensus in the near future.

Shenzhen is a mega city just next to Hong Kong (about 30 mins train ride), well known as the hub of innovation and technology. It hosts a number of large high-tech companies, such as Tencent, Huawei, DJI and so on. It will be also a suitable place for the BMG conference in the sense that it houses many local industries interested in the applications of metals and alloys, such as BMGs and HEAs. After all, Shenzhen University is also one of the major co-organizers for this BMG XIII.

For a smooth transition, all the invitations and already approved applications remain valid. However, in view of the changes and rapid development in the field, we will continue welcoming new submissions, and the new submission deadline will be announced soon.

We are looking forward to meeting you in Shenzhen.

Best regards,

Local organizers:
Yong Yang, Professor, Department of Mechanical Engineering (MNE), City University of Hong Kong
Jacob C. Huang, Chair Professor, Department of Materials Science and Engineering (MSE) and Executive Director, Hong Kong Institute for Advanced Study (IAS), City University of Hong Kong
Jun Shen, Professor, College of Mechatronics and Control Engineering, Shenzhen University

International Advisory Board Chair:
T. G. Nieh, Chair Professor, University of Tennessee, USA


About BMG XIII

The 13th International Conference on Bulk Metallic Glasses (with High Entropy Alloys) will be held December 9 - 13, 2019 at City University of Hong Kong (CityU) in Hong Kong Special Administrative Region, China. It is a continuation of the previous twelve events which were held in Singapore (September 2000), Keelung, Taiwan (March 2002), Beijing, China (October 2003), Gatlinburg, USA (May 2005), Hyogo, Japan (October 2006), Xi'an, China (May 2008), Pusan, Korea (November 2009), Hong Kong, China (May 2011), Xiamen, China (December 2012), Shanghai, China (June, 2014), and St Louis, USA (June, 2016), Seoul, Korea (May, 2018) respectively.

The objective of this conference is to provide an international forum to discuss recent progress and achievement in both fundamentals and applications of bulk metallic glasses, including chemically complex alloys, such as high entropy alloys. The conference will offer a highly interactive environment to stimulate technical discussions and exchanges, with the active participation of materials scientists, engineers, applied physicists and chemists from all over the world.


Welcome Message

Welcome to the 13th international conference on bulk metallic glasses including high entropy alloys (BMG XIII), which will be held in City University of Hong Kong, Kowloon, Hong Kong, from December 9 to 13 (Monday to Friday), 2019. This conference is organized jointly by Hong Kong Institute for Advanced Study (HKIAS) in City University of Hong Kong, and College of Mechatronics and Control Engineering in Shenzhen University.

Since the commencement almost two decades ago, BMG conferences have become important events for materials scientists and engineers. While BMG XIII is a continuation of the previous twelve conferences, its scope is expanded this time to cover not only bulk metallic glasses but also high entropy alloys in view of the recent advancement in these two fields. BMG XIII will include plenary and keynote presentations as well as technical oral and poster presentations, and will provide all attendees with great opportunities to demonstrate and exchange their recent research results.

Aside from attending the conference, we truly hope that you will also enjoy a wide varieties of social and cultural activities in Hong Kong, the city well known as the “Pearl of East Asia”, in her best season throughout the whole year.

We are sincerely looking forward to hosting you over BMG XIII in Hong Kong.


Conference Poster

Download conference poster, please click here.


Conference Updates

Date News
16 September 2019 Early bird registration is now open, please click here for details.
16 September 2019 Acceptance notification is sending to authors in progress, there is a chance that your email service provider would recognized our emails as junk mail, please add our email addresses to safe sender list.
2 September 2019 Registration guideline is now available, please visit here for details.
29 July 2019 Early bird registration period and regular registration period changed, please visit here for details.
28 June 2019 Abstract submission deadline extended to 31 August 2019, please visit here for details.
31 May 2019 Abstract submission deadline extended to 30 June 2019, please visit here for details.
1 February 2019 Abstract submission starts on 1 February 2019, please visit here for details.